New PDF release: Advanced microsystems for automotive applications 2004: [8th

By Jnrgen Valldorf, Jürgen Valldorf, Wolfgang Gessner

Microsystems purposes (MST) in cars became common: they allow the creation of a chain of latest services and even as the substitute of latest applied sciences supplying more desirable functionality and higher price for funds. Microsystems are necessary for pleasing an entire transition from the automatically pushed motor vehicle procedure to a routinely dependent yet ICT-driven process as a part of a likewise complicated atmosphere. With the creation of micro-systems a chain of demanding situations come up concerning complexity, platforms layout, reliability, serviceability, and so forth. those demanding situations must be addressed in an effort to meet excessive consumer expectancies bearing on functionality and value.

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And finally, some modules may be introduced with the sole intent to reduce power consumption. Figure 1 shows a typical architecture of a wheel module with the required functions. Pressure Measure (1) – The event must power up the sensing element, convert its variation to a voltage, store that result using a sample and hold capacitor and then shut down. 25 26 Safety Temperature Measure (2) - The event must power up the sensing element, convert its variation to a voltage, store that result using a sample and hold capacitor and then shut down.

Temperature coefficient of zero over temperature. Over temperature, the performance of the device can change and thus calibration at other temperatures means increased accuracy at those temperatures. Examples of the ability of the DSP to correct errors in the sensor’s output are shown in figures 3, 4 and 5. As can be seen in the figures, the algorithm used can be adapted to easily correct pressure non-linearities of various orders and further can facilitate correction that might be introduced by temperature dependent pressure non-linearities from gelling or other media interfaces.

The silicon nitride is used to isolate the top and bottom plates of the pressure sensor and also protect the CMOS area from subsequent micromachining steps. The sacrificial layer of the sensor is next deposited using a phosphorus-doped glass. The thickness of this layer defines the spacing between the bottom fixed electrode and the moveable diaphragm. The spacer layer is also patterned for transducer designs, which utilize internal support posts for improved pressure linearity.. The sensor diaphragm is then formed by deposition of a LPCVD polysilicon layer.

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